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IPC standards and origin

IPC -Institute Of Printed Circuits, International Electronics Industry Association is a global non-profit electronics industry association. IPC was launched in 1957 with 6 PCB manufacturers.IPC is headquartered in Illinois, Bannockburn, Chinese is headquartered in Qingdao, New Mexico, Taos, Virginia, Arlington, Stockholm, Sweden, India, Bangalore, Moscow and Thailand, Bangkok and other places have offices.

 

IPC- service object

1.Electronics industry
2.Electronic circuit design
3.printed circuit industry
4.Electronic assembly industry
5.OEMs, EMS, Suppliers, Trainers, Labs, Service Providers

 

Why use IPC standards

1. master the quality and reliability of the final product:
Quality and reliability is the cornerstone of maintaining market competitiveness, but also the company's reputation and profitability is also crucial. Throughout the production process, through the implementation of IPC standards, your company's products have better performance and longer service life.
2. improve communication with suppliers and employees:
The IPC standard is the standard used by your competitors, suppliers and EMS manufacturers. At work, an existing IPC standard can become a "common language" - the language of the global electronics industry. In addition, the use of IPC standard can eliminate the confusion of employees, because they know their work needs to meet the standard requirements
3.help control costs:
If your design is in line with the IPC standard, and your production process and quality control are in accordance with IPC standards, then your production will be able to minimize delays, rework and scrap.

IPC standards
IPC-M-105              Rigid Printed Board Manual 
IPC-D-325A            Documentation Requirements for Printed Boards 
IPC-PE-740A          Troubleshooting for Printed Board Manufacture and Assembly
IPC-6010 Series     IPC-6010 Qualification and Performance Series
IPC-6011                Generic Performance Specification for Printed Boards 
IPC-6013A              Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)  
IPC-6016                Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 
IPC-6012A-AM       Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 
IPC-6018A              Microwave End Product Board Inspection and Tech 
IPC-6015                Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 
IPC-A-600G            Acceptability of Printed Boards 
IPC-QE-605A       Printed Board Quality Evaluation Handbook 
IPC-HM-860            Specification for Multilayer Hybrid Circuits
IPC-TF-870             Qualification and Performance of Polymer Thick Film Printed Boards
IPC-ML-960            Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 
IPC-TR-481            Results of Multilayer Tests Program Round Robin
IPC-TR-551           Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 
IPC-TR-579           Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 
IPC-4552               Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 
IPC-DR-572           Drilling Guidelines for Printed Boards 
IT-95080                Improvements/Alternatives to Mechanical Drilling of PCB Vias
IPC-NC-349          Computer Numerical Control Formatting for Drillers and Routers
IPC-SM-839          Pre & Post Solder Mask Application Cleaning Guidelines
IPC-HDI-1             High Density Interconnect Microvia Technology Compendium
IPC/JPCA-4104    Specification for High Density Interconnect (HDI) and Microvia Materials
IPC-6016              Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 
IPC/JPCA-6801    IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection 
IPC-DD-135         Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 
IT-96060              High Density PCB Microvia Evaluation (October Project), Phase I, Round 1
IT-97071              High Density PCB Microvia Evaluation, Phase I, Round 2
IT-30101              High Density PCB Microvia Evaluation, Phase I, Round 3
IT-98123              Microvia Manufacturing Technology Cost Analysis Report
IPC-2141             Controlled Impedance Circuit Boards & High Speed Logic Design
IPC-2252             Design Guide for RF/Microwave Circuit Boards 
IPC-4103            Specification for Base Materials for High Speed/High Frequency Applications 
IPC-6018A          Microwave End Product Board Inspection and Test 
IPC-D-317A        Design Guidelines for Electronic Packaging Utilizing High Speed Techniques
IPC-M-102          Flexible Circuits Compendium 
IPC-4202            Flexible Base Dielectrics for Use in Flexible Printed Circuitry
IPC-4203            Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 
IPC-4204            Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-6013-K        Qualification & Performance Specification for Flexible Printed Boards & Amendment 1 
IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards 
IPC-FA-251        Guidelines for Assembly of Single- and Double-Sided Flex Circuits
IPC-FC-234        Composite Metallic Materials Specification for Printed Wiring Boards
IPC-MB-380       Guidelines for Molded Interconnection Devices 
IPC-M-107         Standards for Printed Board Materials Manual 
IPC-MI-660        Incoming Inspection of Raw Materials Manual 
IPC-4101A         Specifications for Base Materials for Rigid and Multilayer Printed Boards
IPC-4121           Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 
IPC-4562           Metal Foil for Printed Wiring Applications 
IPC-CF-148A     Resin Coated Metal for Printed Boards 
IPC-CF-152B     Composite Metallic Materials Specification for Printed Wiring Boards
IPC-TR-482       New Developments in Thin Copper Foils 
IPC-TR-484       Results of IPC Copper Foil Ductility Round Robin Study
IPC-TR-485       Results of Copper Foil Rupture Strength Test Round Robin Study
IPC-4412           Specification for Finished Fabric Woven from ”E” Glass for Printed Boards
IPC-4130           Specification & Characterization Methods for Nonwoven "E" Glass Materials
IPC-4110           Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
IPC-4411-K       Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1 
IPC-4411-AM1  Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1 
IPC-SG-141      Specification for Finished Fabric Woven from "S" Glass for Printed Boards
IPC-A-142         Specification for Finished Fabric Woven from Aramid for Printed Boards
IPC-QF-143      Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 
IPC-2524          PWB Fabrication Data Quality Rating System 
IPC-9151A        Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database
IPC-9191          General Guidelines for Implementation of Statistical Process Control (SPC) 
IPC-9199          Statistical Process Control (SPC) Quality Rating 
IPC-9252          Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 
IT-97061           PWB Hole to Land Misregistration: Causes and Reliability
IT-98103           Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 
IPC-MS-810     Guidelines for High Volume Microsection 
IPC-QL-653A   Certification of Facilities that Inspect/Test Printed Boards, Components & Materials 
IPC-TR-483     Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test

IPC-TR-486     Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 

 

 

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