Rigid PCB Capacity

Items	Mass production	Sample
Standard	IPC Class II & III or specified by customer	IPC Class II & III or specified by customer
Material	FR1, CEM-1, FR-4,Aluminum, high frequency (ROGERS, TEFLON, TACONIC)	FR1, CEM-1, FR-4,Aluminum, high frequency (ROGERS, TEFLON, TACONIC)
Layers number	1-32 layers	1-40 layers
Max. Panel Size	24"*32" ( 609mm*813mm )	24.5” × 47”  ( 622mm ×1200mm )
Max. Board Thickness	6mm	8mm
Min. Board Thickness	0.4mm	0.2mm
Min. line width/spacing	0.1/0.1mm(4/4mil)	0.076/0.076mm(3/3mil)
Min. Hole Size	0.2mm(7.87mil)	0.15mm(6mil)
PTH Dia. Tolerance	±0.076mm(±3mil）	±0.05mm(±2mil）
NPTH Dia. Tolerance	±0.05mm(±2mil）	±0.025mm(±1mil）
Hole Position Deviation	±0.076mm(±3mil）	±0.05mm(±2mil）
Max. Aspect ratio	10:1	12:1
Heavy copper	4 OZ (140um)	6 OZ （210um）
Hole wall copper thickness of PTH	18-50um	18-50um
Surface Finished	OSP,HASL,HASL(lead free),Gold Finger, ENIG, Immersion Silver, Immersion Tin	OSP,HASL,HASL(lead free),Gold Finger, ENIG, Immersion Silver, Immersion Tin
Max. solder mask or resin plug hole diameter	0.6mm	0.8mm
Min. solder mask dam	3mil	3mil
Solder Mask color(LPI)	Green, Black, Blue, White, Yellow, Red	Green, Black, Blue, White, Yellow, Red
Silkscreen color	White , Black	White ,Black
Outline	Routing, V-CUT, Beveling, Punching	Routing, V-CUT, Beveling ,Punching
Outline Tolerance	±0.13mm(±5mil)	±0.1mm(±4mil)
Peelable Mask	Top, bottom, double Sided	Top, bottom, double Sided
Impedance Control	±10%	±8%
Warp and Twist	≤0.75%	≤0.5%
Flammability	94V-0	94V-0