| Name: | 10-layer interconnected HDI---High Density Interconnect |
|---|---|
| Layer: | 10L |
| Material: | FR4 TG170℃ |
| Finish thickness: | 1.6mm |
| Surface finish: | Immersion gold (ENIG) |
| Solder mask color: | Green |
| Silkscreen color: | White |
| Copper thickness: | 1OZ |
Product Description
10-layer interconnected HDI(High Density Interconnect) PCB product.
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