Fast PCB,Small batch, Mass production

 PCB specification

• §  Layer: 1 to 30 layers
• §  Material: FR-4, CEM-1, CEM-3, Hight TG, FR4 halogen free, FR-1, FR-2,Aluminum etc.
• §  Max. finished thickness: 0.2 to 4.0mm (0.02 ~ 0.25″)
• §  Max. finished board side: 500 x 500mm (20 x 20”)
• §  Min. drilled hole size: 0.25mm (10mil)
• §  Min. line width: 0.10mm (4mil)
• §  Min. line spacing: 0.10mm (4mil)
• §  Surface finish/treatment: HALS/HALS lead free, chemical tin, chemical gold, immersion gold, plating gold
• §  Copper thickness: 0.5 to 3.0 oz
• §  Solder mask color: green/black/white/red/blue
• §  Inner packing: plastic bag
• §  Outer packing: standard carton packing
• §  Hole tolerance: PTH: ±0.076, NTPH: ±0.05
• §  Certificate: UL, ISO 9001, ISO 14001, RoHS,UL
• §  Profiling punching: routing, V-cut, beveling
• §  Providing OEM service to all sorts of printed circuit board assembly